Limit search to available items
Book Cover
E-book

Title Advanced electronic packaging : with emphasis on multichip modules / edited by William D. Brown
Published New York : IEEE Press, [1999]
©1999
Online access available from:
IEEE ebooks    View Resource Record  

Copies

Description 1 online resource (xxxii, 789 pages) : illustrations
Series IEEE Press series on microelectronic systems
IEEE Press series on microelectronic systems.
Contents Introduction and Overview of microelectronics packaging / W.D. Brown -- Microelectronics packaging materials and applications / W.D. Brown -- Electrical design considerations / S.S. Ang -- Modeling and simulation / L.W. Schaper -- Thermal design and management of electronics / R.J. Couvillion -- Mechanical design considerations / W.F. Schmidt -- Packaging trade-offs and decisions / L.W. Schaper -- Computer-aided engineering and design / D.L. Andrews [and others] -- Processing technologies in microelectronic packaging / H.A. Naseem -- Materials and processing considerations / S.S. Ang and W.D. Brown -- Reliability considerations / R.K. Ulrich -- Testing and qualification / S. Kolluru and D. Berleant -- Mainframe packaging: the thermal conduction module (TCM) / T.G. Lenihan -- An industry perspective on MCM-D / J.C. Demmin -- Automotive multichip modules / R.W. Johnson and J.L. Evans -- Analytical techniques for materials characterization / S. Nasrazadani, I. Fritsch, and C.S. Henry -- Cost considerations / E.M. Malstrom -- Advanced topics and future trends in MCM technology / J.E. Brewer, W.D. Brown, and S.S. Ang
Summary An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs. Also addressed are the critical role of economics and future trends in electronic packaging
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Microelectronic packaging.
Multichip modules (Microelectronics) -- Design and construction.
Form Electronic book
Author Brown, William D., 1943-
ISBN 0470544082
9780470544082
(alk. paper)
(alk. paper)