Front Matter; Electronic Manufacturing and the Integrated Circuit; Integrated Circuit Manufacturing: A Technology Resource; Packaging the IC--Single Chip Packaging; The Chip Scale Package; Multichip Packaging; Known Good Die (KGD); Packaging Options--Chip on Board; Chip & Wire Assembly; Tape Automated Bonding--TAB; Flip Chip--The Bumping Processes; Flip Chip Assembly; HDI Substrate Manufacturing Technologies: Thin Film Technology; HDI Substrate Manufacturing Technologies: Thick Film Technology; HDI Substrate Manufacturing Technologies: Cofired Ceramic
Summary
Reviewing the various IC packaging, assembly, and interconnection technologies, this work provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It also includes a discussion of high density PWBs using build up/sequential processes
