| Description |
1 online resource (xii, 284 pages) : illustrations |
| Series |
Integrated circuits and systems |
|
Integrated circuits and systems.
|
| Contents |
Introduction / Kerry Bernstein -- 3D process technology considerations / Albert M. Young and Steven J. Koester -- Thermal and power delivery challenges in 3D ICs / Pulkit Jain [and others] -- Thermal-aware 3D floorplan / Jason Cong and Yuchun Ma -- Thermal-aware 3D placement / Jason Cong and Cuojie Luo -- Thermal via insertion and thermally-aware routing in 3D ICs / Sachin S. Sapatnekar -- Three-dimensional microprocessor design / Gabriel H. Loh -- Three-dimensional network-on-chip architecture / Yuan Xie, Narayanan Vijaykrishnan, and Chita Das -- PicoServer: using 3D stacking technology to build energy efficient servers / Taeho Kgil, David Roberts, and Trevor Mudge -- System level 3D IC cost analysis and design exploration / Xiangyu Dong and Yuan Xie |
| Summary |
"This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs"--Publisher description |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Integrated circuits -- Design and construction.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- General.
|
|
Ingénierie.
|
|
Integrated circuits -- Design and construction
|
| Form |
Electronic book
|
| Author |
Xie, Yuan, 1973-
|
|
Cong, Jason
|
|
Sapatnekar, Sachin S., 1967-
|
| ISBN |
9781441907844 |
|
144190784X |
|
