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Very relevant titles entries 59-743 |
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2022
Cham : Springer, [2022]
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2022
Cham : Springer, [2022]
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2022
Cham : Springer, [2022]
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2022
Singapore : Springer, [2022]
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2022
Singapore : Springer, 2022
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2022
Cham : Springer, 2022
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2022
Singapore : Springer, [2022]
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2022
Singapore : Springer, 2022
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2022
IRC Conference on Science, Engineering and Technology (7th : 2021 : Singapore)
Singapore : Springer, 2022
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2022
Singapore : Springer, [2022]
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2022
International Conference on Atomic, Molecular, Optical & Nano Physics with Applications (2019 : Delhi, India)
Singapore : Springer, 2022
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2022
Agarwal, Pooja
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2022
Wypych, George, author.
Third edition
Scarborough, Ontario : ChemTec Publishing, 2022
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2022
Amsterdam : Elsevier, 2022
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2022
Amsterdam : Elsevier, [2022]
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2022
Amsterdam, Netherlands : Elsevier, [2022]
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2022
Amsterdam, Netherlands ; Oxford, United Kingdom ; Cambridge, MA, United States : Elsevier, [2022]
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2022
London, United Kingdom : Academic Press, [2022]
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2022
Singapore : Springer, [2022]
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2022
Second edition
London : Academic Press, 2022
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2021
Asia Conference on Mechanical and Materials Engineering (9th : 2021 : Online), author.
Zurich : Trans Tech Publications, Limited, [2021]
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2021
International Atomic Energy Agency, issuing body.
Vienna : International Atomic Energy Agency, 2021
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2021
New York, NY : Humana Press, [2021]
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2021
Singapore : Springer Singapore : Imprint: Springer, 2021
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2021
Switzerland : Trans Tech Publications Ltd, 2021
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2021
Acharya, Rituparna
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2021
Perez, Serge
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2021
Rehm, Bernd H. A
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2021
Hoboken, NJ : John Wiley & Sons, Inc. ; Beverly, MA : Scrivener Publishing LLC, 2021
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2021
Singapore : Jenny Stanford Publishing Pte. Ltd., [2021]
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2021
International Conference on Advanced Production and Industrial Engineering (2019)
Singapore : Springer, [2021]
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2021
China Academic Conference on Printing and Packaging (11th : 2020 : Guangzhou, China)
Singapore : Springer, [2021]
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2021
Cham, Switzerland : Springer, [2021]
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2021
Cham : Springer, [2021]
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2021
Singapore : Springer, 2021
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2021
Singapore : Springer, [2021]
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2021
Singapore : Springer, 2021
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