| Description |
1 online resource (179 p.) |
| Contents |
Cover -- Title Page -- Copyright -- Contents -- About the Authors -- Preface -- Acknowledgments -- Chapter 1 A Brief History of Artificial Light and LED Packaging -- 1.1 Evolution in Artificial Light -- 1.2 Impact of Light-Emitting Diode on the World -- 1.3 LED Industrial Chain -- 1.4 Evolution in LED Packaging Technology -- 1.4.1 Low-Power Package Evolution -- 1.4.2 Mid-Power LED Packages -- 1.4.3 LED High-Power and Ultra-High-Power Packages -- 1.5 Summary -- References -- Chapter 2 Fundamentals of LED Packaging Technology -- 2.1 Effective Light Extraction |
|
2.1.1 Theory of Light Conversion in LED -- 2.1.2 Light Extraction Based on Chip Technology -- 2.1.2.1 Chip Surface Roughing -- 2.1.2.2 Buried Micro-Reflectors Chip -- 2.1.2.3 Chip Geometrical Shaping and Type -- 2.1.3 Light Extraction Based on High Reflective Packaging Material -- 2.1.3.1 Leadframe Plating Surface Influence -- 2.1.3.2 Housing Material Reflectivity -- 2.1.3.3 Encapsulation Material Light Extraction Efficacy -- 2.1.4 Optical Interface Enhancing Light Extraction -- 2.2 Package Design and Encapsulation Technology -- 2.2.1 Package Design -- 2.2.1.1 Design for Cost |
|
2.2.1.2 Design for Reliability -- 2.2.1.3 Design for Manufacturing -- 2.2.1.4 Design for Testing -- 2.2.1.5 Design for Environment -- 2.2.1.6 Design for Assembly at Second Level PCB Board -- 2.2.1.7 Design for Effective Light Extraction -- 2.2.2 Encapsulation of LED -- 2.2.2.1 Epoxy, Silicone, and Hybrid Compound Encapsulation -- 2.2.2.2 Hermetic Sealed Package - Metal Can -- 2.2.2.3 Epoxy Cap Encapsulation -- 2.2.2.4 Glass Cap on Ceramic or Aluminum Encapsulation -- 2.3 LED Thermal Management -- 2.3.1 Fundamental of the LED Thermal Behaviors -- 2.3.2 Thermal Design in LED Package |
|
2.3.3 Impact of Thermal Behavior of an LED on Its Performance -- 2.4 Electrical Contact Design -- 2.5 LED Light Conversion Principle -- 2.6 Summary -- References -- Chapter 3 LED Packaging Manufacturing Technology -- 3.1 LED Packaging Process Flow -- 3.1.1 Die-Attach Process -- 3.1.1.1 Die-Attach and Glue Curing Process -- 3.1.2 Wire Bonding Process -- 3.1.3 Surveillance Checking Using Statistical Process Control -- 3.1.4 Encapsulation Process and Post-Mold Curing Process -- 3.1.5 Singulation Process -- 3.1.6 Final Test and Auto Vision System Process -- 3.1.7 Packing Process |
|
3.2 Common Defects in LED Packaging Industry -- 3.2.1 Die-crack: Impact on the Electrical and Optical Properties of LED -- 3.2.2 Lifted Die or Glue: Impact on LED Thermal Behavior and LED Performance -- 3.2.3 Wire Interconnect Defects: Impact on LED Electro-optical Quality -- 3.3 Summary -- References -- Chapter 4 LED Automotive Lighting Application Technology -- 4.1 Basic Science of Light for Automotive - The Photometric -- 4.1.1 Light Intensity -- 4.1.2 Luminous Flux -- 4.1.3 Illuminance -- 4.1.4 Luminance -- 4.1.5 Luminous Efficacy -- 4.2 Lighting - Light Projection "To See" -- 4.2.1 Headlamp |
| Notes |
Description based upon print version of record |
|
4.2.2 Adaptive Front-Lighting System - Headlamp |
| Form |
Electronic book
|
| Author |
Saheed, Mohamed Salleh M
|
|
Jose, Rajan
|
| ISBN |
9783527831685 |
|
3527831681 |
|
3527831673 |
|
9783527831678 |
|
3527831665 |
|
9783527831661 |
|
