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Title Advanced adhesives in electronics : materials, properties and applications / edited by M.O. Alam and C. Bailey
Published Cambridge, UK ; Philadelphia, PA, USA : Woodhead Pub., 2011
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Description 1 online resource (x, 268 pages) : illustrations
Series Woodhead Publishing in materials
Woodhead Publishing in materials.
Contents Cover; Advanced adhesives in electronics: Materials, properties and applications; Copyright; Contents; Contributor contact details; 1 Introduction to adhesives joining technology for electronics; 1.1 Introduction; 1.2 Classification of adhesives used in electronic packaging; 1.3 A brief overview of electronic assemblies; 1.4 Typical uses of advanced adhesives in electronics; 1.5 References; Part I Types of adhesives; 2 Thermally conductive adhesives in electronics; 2.1 Introduction; 2.2 Model of heat conductance; 2.3 Heat transport in thermally conductive adhesives
2.4 Thermally conductive fillers2.5 Role of polymer base materials; 2.6 Thermal conductivity of adhesives and methods for its measurement; 2.7 Conclusions; 2.8 References; 3 Anisotropic conductive adhesives in electronics; 3.1 Introduction; 3.2 Nature of adhesive bond; 3.3 Materials and processing; 3.4 Critical loading; 3.5 Evaluation methods; 3.6 Case studies; 3.7 Conclusions; 3.8 Acknowledgments; 3.9 References; 3.10 Appendix: List of abbreviations; 4 Isotropic conductive adhesives in electronics; 4.1 Introduction; 4.2 General isotropic conductive adhesive (ICA) properties; 4.3 Reliability
4.4 Modeling4.5 Nanotechnologies in isotropic conductive adhesives; 4.6 Conclusions; 4.7 References; 5 Underfill adhesive materials for flip chip applications; 5.1 Introduction: flip chip and direct chip attachment technology; 5.2 Advantages of direct chip attachment technology; 5.3 Reliability challenge of flip chip technology; 5.4 Advances in the flip chip underfill process and encapsulant materials; 5.5 New material challenges to lead-free solder; 5.6 The 'no-flow' pre-applied underfill process; 5.7 The wafer level pre-applied underfill process
5.8 The wafer level dual encapsulation process5.9 Conclusions; 5.10 References; Part II Processing and properties; 6 Structural integrity of metal-polymer adhesive interfaces in microelectronics; 6.1 Introduction; 6.2 Theoretical considerations of work of fracture and bonding strength of adhesive joints; 6.3 Chemical and physical intermolecular interactions at interfaces; 6.4 Other influential factors determining bond strength of real adhesive joints; 6.5 Effect of environmental factors; 6.6 Interconnections using electrically conductive adhesives; 6.7 Conclusions; 6.8 References
7 Modelling techniques used to assess conductive adhesive properties7.1 Introduction; 7.2 Numerical modelling technologies; 7.3 Modelling applied to packaging processes; 7.4 Modelling the thermal, electrical and mechanical performance of adhesives; 7.5 Future trends; 7.6 Conclusions; 7.7 References; 8 Adhesive technology for photonics; 8.1 Introduction; 8.2 The major characteristics of adhesives for photonic applications; 8.3 Types of adhesive used in photonics; 8.4 Major applications of adhesives in photonics; 8.5 Adhesives for photonic packaging; 8.6 Adhesives used in photonic devices
Summary Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applicationsProvides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systemsFocuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Adhesive joints.
Adhesives -- Electric properties.
Electronic packaging -- Materials.
Electronics -- Materials.
Form Electronic book
Author Alam, M. O. (Mohammad O.)
Bailey, C
ISBN 0857092898 (electronic bk.)
9780857092892 (electronic bk.)