| Description |
1 online resource (xxiv, 530 pages) : illustrations |
| Contents |
1. Introduction -- 2. Chemical Vapor Deposition of Aluminum -- 3. Chemical Vapor Deposition of Tungsten -- 4. Chemical Vapor Deposition of Copper from Copper(II) Precursors -- 5. Chemical Vapor Deposition of Copper from Copper(I) Precursors -- 6. Chemical Vapor Deposition of Gold and Silver -- 7. Chemical Vapor Deposition of Platinum, Palladium and Nickel -- 8. Chemical Vapor Deposition of Assorted Metals -- 9. Overview of Metal CVD -- Appendix 1: Examples of Chemical Nomenclature |
| Summary |
High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the g |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Chemical vapor deposition.
|
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Electronic circuit design.
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Metallic films.
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| Form |
Electronic book
|
| Author |
Hampden-Smith, Mark J.
|
|
Kodas, Toivo T. (Toivo Tarmo), 1958-
|
| ISBN |
3527615849 (electronic bk.) |
|
9783527615841 (electronic bk.) |
|
