| Description |
Online resource |
| Summary |
Research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design |
| Issuing Body |
A publication of the IEEE Electromagnetic Society, the IEEE Microwave Theory and Techniques Society, IEEE Council on Electronic Design Automation, and the Electronics Packaging Society |
| Notes |
Description based on: Volume 1 (2022) ; title from PDF title page (ieeexplore.ieee.org viewed Oct. 13, 2022) |
|
Latest issue consulted: Volume 1 (2022) (ieeexplore.ieee.org viewed Oct. 13, 2022) |
| Subject |
Signal integrity (Electronics) -- Periodicals
|
|
Integrated circuits -- Design and construction -- Periodicals
|
| Form |
Electronic journal
|
| Author |
Electronics Packaging Society
|
|
IEEE Council on Electronic Design Automation
|
|
IEEE Microwave Theory and Techniques Society
|
| LC no. |
2021201192 |
| ISSN |
2768-1866 |
|
