Title TSV 3D RF integration : high resistivity Si interposer technology / Shenglin Ma and Yufeng Jin

Published Amsterdam, Netherlands : Elsevier, 2022

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Description 1 online resource Notes Print version record Subject Three-dimensional integrated circuits. Silicon -- Electric properties. Radio frequency integrated circuits. Radio frequency integrated circuits Silicon -- Electric properties Three-dimensional integrated circuits Form Electronic book Author Jin, Yufeng, author. ISBN 0323996035 9780323996037

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