| Description |
1 online resource (xi, 86 pages) : illustrations |
| Series |
SpringerBriefs in Applied Sciences and Technology, 2191-530X |
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SpringerBriefs in applied sciences and technology.
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| Contents |
Preface; Contents; About the Authors; 1 Interconnects; Abstract ; 1.1 Introduction; 1.2 Types of Interconnects; 1.3 Evolution of Interconnects; 1.3.1 Aluminum Interconnects; 1.3.2 Reason Behind the Replacement of Al by Cu; 1.3.3 Demerits of Cu Interconnects; 1.3.4 Demands in Future Interconnects; 1.4 Carbon Nanotubes: The Ultimate Choice; 2 Carbon Nanotube: Properties and Applications; Abstract ; 2.1 Introduction; 2.2 Structure and Types of Carbon Nanotubes; 2.3 Electronic Band Structure of CNTs; 2.3.1 Band Structure of CNTs from Graphene |
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2.3.2 Metallicity and Semiconducting Properties of Zigzag CNTs2.4 Properties of CNTs; 2.4.1 Electrical Conductivity; 2.4.2 Strength and Elasticity; 2.4.3 Thermal Conductivity and Expansion; 2.4.4 Field Emission; 2.4.5 Aspect Ratio; 2.4.6 Absorbent; 2.5 Production of CNTs; 2.5.1 Arc Discharge Method; 2.5.2 Laser Method; 2.5.3 Chemical Vapor Deposition; 2.5.4 Ball Milling; 2.5.5 Other Methods; 2.6 Purification of CNTs; 2.6.1 Gas Phase; 2.6.2 Liquid Phase; 2.6.3 Intercalation; 2.7 Application of CNTs; 2.7.1 Structural; 2.7.2 Electromagnetic; 2.7.3 Electroacoustic; 2.7.4 Chemical |
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2.7.5 Mechanical2.7.6 Optical; 2.7.7 Electrical Circuits; 2.7.8 Interconnects; 2.7.9 Transistors; 3 Modeling of Carbon Nanotube Interconnects; Abstract ; 3.1 Introduction; 3.2 Analytical Models: A Technical Review; 3.2.1 Lüttinger Liquid Theory Based Model; 3.2.2 Electron Transport Theory Based Model; 3.2.3 Models Based on Physical Parameters of CNTs; 3.2.4 Diameter Dependent Modeling of CNT Interconnects; 3.2.5 Models Based on Process Induced Parameters; 3.2.6 Compact Physical Models of SWNT and MWNT Interconnects; 3.2.7 Performance Comparison of SWNT Bundles and MWNT Interconnect Models |
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3.2.8 CNT Interconnect Models for FPGA Applications3.2.9 CNT Interconnect Models for Crosstalk Analysis; 3.2.10 Modeling of Mixed CNT Bundle Interconnects; 3.3 Geometry and Equivalent RLC Model of CNT Interconnect; 3.3.1 SWNT Interconnect; 3.3.2 DWNT Interconnect; 3.3.3 MWNT Interconnect; 3.3.4 SWNT Bundle Interconnect; 3.3.5 DWNT Bundle Interconnect; 4 Crosstalk and Delay Analysis; Abstract ; 4.1 Introduction; 4.2 Simulation Setup; 4.2.1 Motivation Behind Using CMOS Driver; 4.2.2 Simulation Setup Using Capacitively Coupled Three-Line Bus Architecture |
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4.3 Crosstalk Induced Delay of Bundled SWNT and DWNT Interconnects4.4 Crosstalk Induced Delay of Bundled SWNT and Single MWNT Interconnects; 4.5 Crosstalk Induced Delay of Bundled SWNT, Bundled DWNT, and Single MWNT Interconnects; 5 Mixed Carbon Nanotube Bundle; Abstract ; 5.1 Introduction; 5.2 Proposed MCB Topologies; 5.3 ESC Model of MCB Interconnects; 5.4 Performance Analysis of MCB Based Interconnects; 5.4.1 Propagation Delay and Power Dissipation of MCB Topologies; 5.4.2 Crosstalk Induced Delay of MCB Topologies; References |
| Summary |
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and a |
| Analysis |
engineering |
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nanotechnologie |
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nanotechnology |
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circuits |
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optische instrumenten |
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optical instruments |
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optica |
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optics |
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Engineering (General) |
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Techniek (algemeen) |
| Bibliography |
Includes bibliographical references |
| Notes |
Online resource; title from PDF title page (SpringerLink, viewed November 20, 2014) |
| Subject |
Interconnects (Integrated circuit technology)
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Integrated circuits -- Very large scale integration -- Design and construction
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Carbon nanotubes.
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Nanotubes, Carbon
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carbon nanotubes.
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Carbon nanotubes
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Integrated circuits -- Very large scale integration -- Design and construction
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Interconnects (Integrated circuit technology)
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| Form |
Electronic book
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| Author |
Majumder, Manoj Kumar, author
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| ISBN |
9788132220473 |
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8132220471 |
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