| Description |
1 online resource |
| Series |
Wiley - IEEE |
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Wiley - IEEE
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| Contents |
Cover; Title Page; Copyright; Contents; Preface; Acknowledgements; About the Companion Website; Nomenclature; Introduction; Chapter 1 Introduction to Modular Multilevel Converters; 1.1 Introduction; 1.2 The Two-Level Voltage Source Converter; 1.2.1 Topology and Basic Function; 1.2.2 Steady-State Operation; 1.3 Benefits of Multilevel Converters; 1.4 Early Multilevel Converters; 1.4.1 Diode Clamped Converters; 1.4.2 Flying Capacitor Converters; 1.5 Cascaded Multilevel Converters; 1.5.1 Submodules and Submodule Strings; 1.5.2 Modular Multilevel Converter with Half-Bridge Submodules |
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1.5.3 Other Cascaded Converter Topologies1.6 Summary; References; Chapter 2 Main-Circuit Design; 2.1 Introduction; 2.2 Properties and Design Choices of Power Semiconductor Devices for High-Power Applications; 2.2.1 Historical Overview of the Development Toward Modern Power Semiconductors; 2.2.2 Basic Conduction Properties of Power Semiconductor Devices; 2.2.3 P-N Junctions for Blocking; 2.2.4 Conduction Properties and the Need for Carrier Injection; 2.2.5 Switching Properties; 2.2.6 Packaging; 2.2.7 Reliability of Power Semiconductor Devices; 2.2.8 Silicon Carbide Power Devices |
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2.3 Medium-Voltage Capacitors for Submodules2.3.1 Design and Fabrication; 2.3.2 Self-Healing and Reliability; 2.4 Arm Inductors; 2.5 Submodule Configurations; 2.5.1 Existing Half-Bridge Submodule Realizations; 2.5.2 Clamped Single-Submodule; 2.5.3 Clamped Double-Submodule; 2.5.4 Unipolar-Voltage Full-Bridge Submodule; 2.5.5 Five-Level Cross-Connected Submodule; 2.5.6 Three-Level Cross-Connected Submodule; 2.5.7 Double Submodule; 2.5.8 Semi-Full-Bridge Submodule; 2.5.9 Soft-Switching Submodules; 2.6 Choice of Main-Circuit Parameters; 2.6.1 Main Input Data |
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2.6.2 Choice of Power Semiconductor Devices2.6.3 Choice of the Number of Submodules; 2.6.4 Choice of Submodule Capacitance; 2.6.5 Choice of Arm Inductance; 2.7 Handling of Redundant and Faulty Submodules; 2.7.1 Method 1; 2.7.2 Method 2; 2.7.3 Comparison of Method 1 and Method 2; 2.7.4 Handling of Redundancy Using IGBT Stacks; 2.8 Auxiliary Power Supplies for Submodules; 2.8.1 Using the Submodule Capacitor as Power Source; 2.8.2 Power Supplies with High-Voltage Inputs; 2.8.3 The Tapped-Inductor Buck Converter; 2.9 Start-Up Procedures; 2.10 Summary; References; Chapter 3 Dynamics and Control |
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3.1 Introduction3.2 Fundamentals; 3.2.1 Arms; 3.2.2 Submodules; 3.2.3 AC Bus; 3.2.4 DC Bus; 3.2.5 Currents; 3.3 Converter Operating Principle and Averaged Dynamic Model; 3.3.1 Dynamic Relations for the Currents; 3.3.2 Selection of the Mean Sum Capacitor Voltages; 3.3.3 Averaging Principle; 3.3.4 Ideal Selection of the Insertion Indices; 3.3.5 Sum-Capacitor-Voltage Ripples; 3.3.6 Maximum Output Voltage; 3.3.7 DC-Bus Dynamics; 3.3.8 Time Delays; 3.4 Per-Phase Output-Current Control; 3.4.1 Tracking of a Sinusoidal Reference Using a PI Controller |
| Summary |
Design, Control and Application of Modular Multilevel Converters for HVDC Transmission Systems is a comprehensive guide to semiconductor technologies applicable for MMC design, component sizing control, modulation, and application of the MMC technology for HVDC transmission. Separated into three distinct parts, the first offers an overview of MMC technology, including information on converter component sizing, Control and Communication, Protection and Fault Management, and Generic Modelling and Simulation. The second covers the applications of MMC in offshore WPP, including planning, technical and economic requirements and optimization options, fault management, dynamic and transient stability. Finally, the third chapter explores the applications of MMC in HVDC transmission and Multi Terminal configurations, including Supergrids. Key features: -Unique coverage of the offshore application and optimization of MMC-HVDC schemes for the export of offshore wind energy to the mainland.-Comprehensive explanation of MMC application in HVDC and MTDC transmission technology.-Detailed description of MMC components, control and modulation, different modeling approaches, converter dynamics under steady-state and fault contingencies including application and housing of MMC in HVDC schemes for onshore and offshore.-Analysis of DC fault detection and protection technologies, system studies required for the integration of HVDC terminals to offshore wind power plants, and commissioning procedures for onshore and offshore HVDC terminals.-A set of self-explanatory simulation models for HVDC test cases is available to download from the companion website. This book provides essential reading for graduate students and researchers, as well as field engineers and professionals who require an in-depth understanding of MMC technology |
| Bibliography |
Includes bibliographical references and index |
| Notes |
English |
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Print version record and CIP data provided by publisher |
| Subject |
Electric current converters -- Design and construction
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Electric current converters -- Automatic control
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Electric power transmission -- Direct current -- Equipment and supplies
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Electric current converters -- Design and construction
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Electric power transmission -- Direct current -- Equipment and supplies
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Convertidors de corrent elèctric.
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Energia elèctrica -- Transmissió -- Corrent continu.
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| Form |
Electronic book
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| Author |
Harnefors, Lennart, 1968- author
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Nee, Hans Peter, 1963- author
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Norrga, Staffan, 1968- author
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Teodorescu, Remus, author
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| LC no. |
2016013688 |
| ISBN |
9781118851524 |
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1118851528 |
|
9781118851548 |
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1118851544 |
|
9781118851555 |
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1118851552 |
|
