Imprints vary, eg Wein: Springer Verlag; New Jersey : IEEE; Tokyo: Business Center Academic Societies
Vols. for <1996-1997> are technical digests
Conference unifies three precedent conferences: International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD); International Conference on Ssimulation of Semiconductor Devices and Processes (SISDEP); International Workshop on VLSI Process and Device Modeling (VPAD)
Description based on: 1998; title from caption (IEEexplore website, viewed Jan. 12, 2008)