| Description |
1 online resource (vii, 481 pages) : illustrations |
| Series |
Surface engineering series ; v. 2 |
|
Surface engineering series ; v. 2.
|
| Contents |
Ch. 1. Introduction to Chemical Vapor Deposition (CVD) / J.R. Creighton and P. Ho -- Ch. 2. Basic Principles of CVD Thermodynamics and Kinetics / A.K. Pattanaik and V.K. Sarin -- Ch. 3. Stresses and Mechanical Stability of CVD Thin Films / M. Ignat -- Ch. 4. Combustion Chemical Vapor Deposition (CCVD) / A.T. Hunt and Matthias Pohl -- Ch. 5. Polarized Electrochemical Vapor Deposition / Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey -- Ch. 6. Chemical Vapor Infiltration: Optimization of Processing Conditions / S.K. Griffiths and Robert H. Nilson -- Ch. 7. Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / C.S. Hwang and H.-I. Yoo |
| Bibliography |
Includes bibliographical references |
| Notes |
Print version record |
| Subject |
Vapor-plating.
|
|
Refractory coating.
|
|
TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
|
|
Refractory coating
|
|
Vapor-plating
|
| Form |
Electronic book
|
| Author |
Park, Jong-Hee, 1951-
|
|
Sudarshan, T. S., 1955-
|
| ISBN |
9781615032242 |
|
161503224X |
|
