| Description |
1 online resource : color illustrations |
| Contents |
Foreword I; Foreword II; Foreword III; Preface; Contents; Contributors; Challenges; 1 Manufacturing Threats; Abstract; 1 Reliability Issues; 2 Process Variation; 2.1 Sources of Front-End Variability; 2.2 Process Variation in Emerging Technologies; 2.3 Process Variation Modelling; 3 Transistor Aging; 3.1 Bias Temperature Instability (BTI); 3.1.1 Deterministic RD Model; 3.1.2 Stochastic Atomistic Trap-Based Model; 3.1.3 Process Variation and Stochastic BTI: Are They Correlated?; 3.2 Hot Carrier Injection (HCI); 3.2.1 HCI Model; 3.3 Coupling Models for BTI and HCI Degradations |
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3.4 Random Telegraph Noise (RTN)3.4.1 RTN Model; 3.5 Time-Dependent Dielectric Breakdown (TDDB); 3.5.1 SBD Model; 3.5.2 HBD Model; 4 Voltage Droop; 4.1 Voltage Droop Metrics and Important Parameters; 4.2 Voltage Droop Model; 5 Soft Error; 5.1 Sources of Radiation; 5.2 Basic Physical Mechanism of Soft Error; 6 Summary; References; 2 Dependability Threats; Abstract; 1 Introduction; 2 Fault Models; 2.1 Fault Classification and Modeling; 2.1.1 Fault Classification; 2.1.2 Fault Modeling; 2.2 Fault Models for Permanent Faults; 2.2.1 Behavioral Fault Models; 2.2.2 Functional Fault Models |
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2.2.3 Structural Fault Models2.2.4 Switch Fault Models; 2.2.5 Geometric Fault Models; 2.2.6 Multiple Fault Models; 2.3 Transient and Intermittent Fault Models; 2.3.1 Origins of the Soft Errors; 2.3.2 Types of Soft Errors; 2.4 Fault Models for Modern Technologies; 2.4.1 Fault Models for Field Programmable Gate Arrays (FPGAs); 2.4.2 Fault Models for Network on Chip; 3 Aging and Lifetime Reliability; 3.1 Device-Level Failure Mechanisms; 3.1.1 Electromigration; 3.1.2 Time-Dependent Dielectric Breakdown; 3.1.3 Stress Migration; 3.1.4 Thermal Cycling; 3.1.5 Sum of Failure Rates |
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3.2 Failure Distributions3.3 Modeling Reliability of a Component in Variable Working Conditions; 3.3.1 Practical Considerations on Reliability Computation; 3.3.2 Reliability Computation for Thermal Cycling; 3.4 Modeling Reliability of a Complex Multi-component System; 3.4.1 System Reliability Computation; 3.4.2 An Example of Reliability Computation of a Multi-Core System; 4 Metrics; References; 3 Application Scenarios; Abstract; 1 Dependability and Advancement of Hardware; 2 Military and Aerospace; 3 Surface Transportation Domain; 4 Energy Domain; 5 Medical and Healthcare; 6 Machine Domain |
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7 Consumer Electronics8 Protection Against Counterfeiting and Different Hardware Security Issues; References; Solutions; 4 Manufacturing Solutions; Abstract; 1 Introduction; 2 Mitigation of Process Variation; 2.1 Classification; 2.2 Static Schemes; 2.3 Process Schemes; 2.4 Design Schemes; 2.5 Dynamic Schemes; 2.6 Hardware-Based Schemes; 2.7 Software-Based Schemes; 3 Mitigation of Transistor Aging; 3.1 Stress-Induced Leakage Current and Gate Oxide Breakdown; 3.2 Bias Temperature Instability; 3.3 Hot Carrier Degradation; 3.4 Self-heating Effect; 3.5 Root Cause 1: Interface Traps |
| Summary |
This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies |
| Bibliography |
Includes bibliographical references |
| Notes |
Online resource; title from PDF title page (EBSCO, viewed September 12, 2017) |
| Subject |
Multiprocessors.
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Nanotechnology.
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Systems analysis & design.
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Reliability engineering.
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Electronics engineering.
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Computer architecture & logic design.
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Circuits & components.
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COMPUTERS -- Computer Literacy.
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COMPUTERS -- Computer Science.
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COMPUTERS -- Data Processing.
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COMPUTERS -- Hardware -- General.
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COMPUTERS -- Information Technology.
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COMPUTERS -- Machine Theory.
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COMPUTERS -- Reference.
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Multiprocessors
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Nanotechnology
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| Form |
Electronic book
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| Author |
Ottavi, Marco, editor
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Gizopoulos, Dimitris, editor.
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Pontarelli, Salvatore, editor
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| ISBN |
9783319544229 |
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3319544225 |
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