| Description |
1 online resource |
| Contents |
Front Cover; Contents; Preface; Acknowledgments; Chapter 1: Semiconductor Basics; Chapter 2: GaAs Devices; Chapter 3: Phase Diagrams and Crystal Growth of Compound Semiconductors; Chapter 4: Epitaxy; Chapter 5: Photolithography; Chapter 6: Wet Etching, Cleaning, and Passivation; Chapter 7: Plasma Processing and Dry Etching; Chapter 8: Deposition Processes; Chapter 9: Ion Implantation and Device Isolation; Chapter 10: Diffusion in III-V Compound Semiconductors; Chapter 11: Ohmic Contacts; Chapter 12: Schottky Diodes and FET Processing; Chapter 13: HEMT Process; Chapter 14: HBT Processing |
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Chapter 15: BiFET and BiHEMT ProcessingChapter 16: MOSFET Processing; Chapter 17: Passive Components; Chapter 18: Interconnect Technology; Chapter 19: Backend Processing and Through-Wafer Vias; Chapter 20: Electroplating; Chapter 21: Measurements and Characterization; Chapter 22: Reliability; Chapter 23: GaN Devices; Chapter 24: RF MEMS; Appendix; Acronyms; Back Cover |
| Summary |
GaAs processing has reached a mature stage. New semiconductor compounds are emerging that will dominate future materials and device research, although the processing techniques used for GaAs will still remain relevant. This book covers all aspects of the current state of the art of III- processing, with emphasis on HBTs. It is aimed at practicing engineers and graduate students and engineers new to the field of III- semiconductor IC processing. The book primary purpose is to discuss all aspects of processing of active and passive devices, from crystal growth to backside processing, including lithography, etching, and film deposition |
| Notes |
Title from content provider |
| Bibliography |
Includes bibliographical references |
| Subject |
Integrated circuits -- Design and construction.
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Semiconductors.
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semiconductor.
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Integrated circuits -- Design and construction.
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Semiconductors.
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| Form |
Electronic book
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| ISBN |
9789814669313 |
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9814669318 |
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