| Description |
1 online resource (xii, 333 pages) : illustrations (some color) |
| Contents |
Interconnect challenges for 2D and 3D Integration.- Overview of Carbon Nanotube Physical Properties.- Overview of Carbon Nanotube Processing Methods.- Electrical Conductivity of Carbon Nanotubes -- Modeling and Characterization.- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material.- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects.- Carbon Nanotubes as Vertical Interconnects for 3D ICs.- Carbon Nanotubes as Micro-Bumps for 3D Integration.- Electrothermal Modeling of Carbon Nanotubes TSVs.- Exploring Carbon Nanotubes for 3D Power Delivery Networks.- Carbon Nanotubes for Monolithic 3D ICs |
| Summary |
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects |
| Notes |
Online resource; title from PDF title page (SpringerLink, viewed July 18, 2016) |
| Subject |
Interconnects (Integrated circuit technology)
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Carbon nanotubes.
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Nanotubes, Carbon
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carbon nanotubes.
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Computer architecture & logic design.
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Circuits & components.
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Carbon nanotubes
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Interconnects (Integrated circuit technology)
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| Form |
Electronic book
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| Author |
To-Sanial, Aida, editor
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Dijon, Jean, editor
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Maffucci, Antonio, editor
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| ISBN |
9783319297460 |
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3319297465 |
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3319297449 |
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9783319297446 |
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