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E-book
Author Hermansen, Ralph D.

Title Polymeric thermosetting compounds : innovative aspects of their formulation technology / Ralph D. Hermansen
Published Toronto : Apple Academic Press, 2016
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Contents Front Cover; Title Page; Copyright Page; About the Author; Contents; List of Abbreviations; Preface; Acknowledgments; Introduction; Part I: Custom Formulating; Chapter 1: Materials and Process Engineering; Chapter 2: The Art and Science of Formulating; Part II: Thermal Transfer Adhesives for Space Electronics; Chapter 3: Thermal Transfer, Filleting Adhesives; Chapter 4: Flexible Epoxy Thermal Transfer Adhesives For Flatpacks; Chapter 5: More About the New Thermal Transfer Adhesives; Chapter 6: Superior Thermal Transfer Adhesive
Chapter 14: Solder Joint Lead EncapsulationPart V: Custom-Formulated Organic Solder to Eliminate Lead; Chapter 15: Formulation of a Drop-Resistant, Organic Solder; Part VI: Rigid Polyurethanes for Aircraft Transparencies; Chapter 16: Sierraclad"!Bird-Proof Canopies and Windshields; Part VII: Three Niche Technologies; Chapter 17: Flexipoxy Technology; Chapter 18: Hacthane Technology; Chapter 19: Transparent Polyurethane Plastics; Part VIII: Spin-Off Applications; Chapter 20: Spin-Off From Our Thermal Transfer Adhesives Patents
Chapter 21: Spin-Off From Our Electrically Conductive Adhesives PatentsChapter 22: Spin-Off From Our Encapsulants, Potting Compounds, and Impregnants Patents; Chapter 23: Spin-Off From Our High-Volume Electronic Assembly Materials Patents; Chapter 24: Spin-Off From Our Specialty Adhesives Patents; Chapter 25: Spin-Off From Our Specialty Rigid Thermosets Patents; Appendix I: The Science of Rubbery Materials; Back Cover
Part III: Other Custom-Formulated Compounds for Aerospace Electronics ApplicationsChapter 7: Radiopaque Adhesive/Sealant; Chapter 8: Low Exotherm, Low-Temperature Curing, Epoxy Impregnants; Chapter 9: Platable Adhesives For Cyanate Ester Composites; Chapter 10: Reworkable, Thermally Conductive, Adhesives For Electronic Assemblies; Chapter 11: Room Temperature-Stable, One-Component, Flexible Epoxy Adhesives; Part IV: Custom-Formulated Compounds for Automotive Electronics Applications; Chapter 12: Air Bag Sensor Encapsulation; Chapter 13: Reactive Hot Melt Conformal Coating Materials
Summary "Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During the author's 40-year career he has successfully worked on many such problems. The uniquely useful and valuable book, Polymeric Thermosetting Compounds: Innovative Aspects of Their Formulation Technology, presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. Author Ralph Hermansen, with years of experience of hands-on experience, is an expert in formulating epoxies, polyurethanes, and other polymers into compounds that have unique properties, and here he shares his knowledge and experience of attaining novel solutions to very challenging problems."-- Provided by publisher
Bibliography Includes bibliographical references and index
Notes Print version record and CIP data provided by publisher; resource not viewed
Subject Elastomers.
Heat resistant plastics.
Materials at high temperatures.
Materials at low temperatures.
Polymers.
Thermosetting composites.
Thermosetting plastics.
Elastomers.
Heat resistant plastics.
Materials at high temperatures.
Materials at low temperatures.
Polymers.
TECHNOLOGY & ENGINEERING -- Chemical & Biochemical.
Thermosetting composites.
Thermosetting plastics.
Form Electronic book
LC no. 2016024240
ISBN 1771883146
1771883154
9781771883146
9781771883153