| Description |
1 online resource (559 pages) |
| Contents |
Surface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling |
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2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology |
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3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern |
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5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection |
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7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing |
| Summary |
Surveying and comparing all techniques relevant for practical applications in surface and thin film analysis, this second edition of a bestseller is a vital guide to this hot topic in nano- and surface technology. This new book has been revised and updated and is divided into four parts - electron, ion, and photon detection, as well as scanning probe microscopy. New chapters have been added to cover such techniques as SNOM, FIM, atom probe (AP), and sum frequency generation (SFG). Appendices with a summary and comparison of techniques and a list of equipment suppliers make this book a rapid ref |
| Notes |
8.1.3 Implantation of Primary Ions |
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Print version record |
| Subject |
Thin films -- Analysis -- Surfaces
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Electron spectroscopy.
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Spectrum analysis.
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Spectrum analysis
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Electron spectroscopy
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Atomic Physics.
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Physics.
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Physical Sciences & Mathematics.
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| Form |
Electronic book
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| Author |
Bubert, Henning
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| ISBN |
9783527636945 |
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3527636943 |
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