| Description |
1 online resource (ix, 179 pages) : illustrations (some color) |
| Series |
Analog Circuits and Signal Processing, 1872-082X |
|
Analog circuits and signal processing series, 1872-082X
|
| Contents |
Preface ; Contents; Introduction: Work Around Moore's Law; 1.1 Scaling Limitations of Conventional Integration Technology: Work Around Moore's Law; Chapter-1; 1.1.1 More Moore: New Architectures; 1.1.1.1 SOI; 1.1.1.2 FinFET; 1.1.1.3 Twin-Well; 1.1.2 More Moore: New Materials; 1.1.2.1 High-K Dielectric; 1.1.2.2 Metal Gate; 1.1.2.3 Strained Si; 1.1.3 More than Moore (MTM): New Interconnects Schemes; 1.1.3.1 3D; 1.1.3.2 NoC; 1.1.3.3 Optical Interconnects; 1.1.3.4 Wireless Interconnects; 1.1.4 Beyond CMOS: New Devices; 1.1.4.1 Molecular Computer: CNT-Based; 1.1.4.2 Biological Computer: DNA-Based |
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1.1.4.3 Quantum Computer: Qubits-Based1.2 Book Organization; References; Chapter-2; 3D/TSV-Enabling Technologies; 2.1 3D/TSV Technology; 2.2 TSV Structure; 2.3 Modeling and Design Challenges for 3D-ICs; 2.3.1 Electrical Modeling Challenges; 2.3.2 Thermal Management Challenges; 2.3.3 CAD Tools Challenges; 2.3.4 Technological, Yield, and Test Challenges; 2.3.5 Design Methodology Challenges; 2.3.6 Circuit Architecture Challenges; 2.3.6.1 3D FPGA; 2.3.6.2 3D Memory; 2.3.6.3 3D Processor; 2.3.6.4 3D NoC; 2.3.7 Power Delivery and Clock Distribution Challenges; 2.4 Summary; References; Chapter-3 |
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TSV Modeling and Analysis3.1 Introduction; 3.2 Modeling Methodology; 3.2.1 EM Modeling Methods; 3.2.2 Physics-Based Lumped Element Model for TSVs; 3.2.3 Nonlinearities (MOS Effect) of a TSV; 3.2.4 Comparison Between Quasi-Static and Full-Wave EM Simulations; 3.2.5 Dimensional Analysis Theory; 3.2.6 Closed-Form Expressions for TSV Model Elements Using Dimensional Analysis; 3.2.6.1 TSV Resistance Modeling; 3.2.6.2 TSV Capacitance Modeling; 3.2.6.3 TSV Inductance Modeling; 3.2.6.4 Final Element Formulae Using Curve Fitting; 3.3 TSV Model Linearization; 3.4 Summary; References; Chapter-4 |
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TSV Verification4.1 Validation Against Electromagnetic Simulation: Frequency Domain and Time Domain; 4.2 Studying the TSV Impact on Circuit Performance; 4.3 Validation Against Device Simulation; 4.4 Summary; References; Chapter-5; TSV Macro-Modeling Framework; 5.1 TSV Macro-Modeling Framework: Analysis and Verification; 5.2 Multi-Stacked TSV; 5.3 Summary; References; Chapter-6; TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications, and TSV-Based Bandpass Filter; 6.1 Introduction: TSV-Based On-Chip Spiral Inductor |
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6.2 TSV-Based Spiral Architecture and Analysis6.2.1 The TSV-Based Spiral Inductor: Analysis and Characterization; 6.2.2 Lumped Element Model for the TSV-Based Spiral Inductor and Derivation of Qmax; 6.2.3 Closed-Form Expressions for the Inductance; 6.3 TSV-Based Spiral Verification; 6.3.1 Validation Against EM Simulation; 6.3.2 Comparison with Related Work; 6.4 Introduction: TSV-Based On-Chip Wireless Communications; 6.5 The Wireless TSV Architecture; 6.5.1 The Wireless TSV: Architecture and Analysis; 6.5.2 EM Simulation Results and Discussions; 6.5.3 Closed-Form Expressions |
| Summary |
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor?and inductive-based |
| Analysis |
engineering |
|
circuits |
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procesarchitectuur |
|
process architecture |
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elektronica |
|
electronics |
|
instrumentatie |
|
instrumentation |
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Engineering (General) |
|
Techniek (algemeen) |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Online resource; title from PDF title page (SpringerLink, viewed Sept. 4, 2014) |
| Subject |
Three-dimensional integrated circuits -- Mathematical models
|
|
TECHNOLOGY & ENGINEERING -- Mechanical.
|
| Form |
Electronic book
|
| Author |
Ismail, Yehea I., 1971- author.
|
|
El-Rouby, Alaa, author
|
| ISBN |
9783319076119 |
|
3319076116 |
|
3319076108 |
|
9783319076102 |
|
