2016

3D IC devices, technologies, and manufacturing

Xiao, Hong, 1961- author

Bellingham, Washington, USA SPIE Press, [2016]

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2016

3D IC integration and packaging

Lau, John H., author

New York : McGraw-Hill Education, [2016]

 

2018

3D integration in VLSI circuits : implementation technologies and applications

Boca Raton, FL : CRC Press/Taylor and Francis Group, [2018]

 

2023

3D Integration of Resistive Switching Memory

Luo, Qing



 

2016

3D stacked chips : from emerging processes to heterogeneous systems

Switzerland : Springer, 2016

 

2015

Advances in 3D integrated circuits and systems

Yu, Hao (Electrical engineer), author.

New Jersey : World Scientific, 2015

 

2014

Design and modeling for 3D ICs and interposers

Swaminathan, Madhavan, author.

Hackensack, NJ : World Scientific, 2014

 

2013

Design and modeling for 3d ics and interposers

Swaminathan, Madhavan



 

2015

Design of 3D integrated circuits and systems

©2015

 

2012

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Li, Er-Ping.



 

2020

MEMS resonator filters

London, United Kingdom : The Institution of Engineering and Technology, 2020