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Subjects (1-10 of 10)
Three-dimensional integrated circuits.
1
Book
2016

3D IC devices, technologies, and manufacturing


Xiao, Hong, 1961- author
Bellingham, Washington, USA SPIE Press, [2016]

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 W'PONDS  621.3815 Xia/Tid  AVAILABLE
2
E-book
2018

3D integration in VLSI circuits : implementation technologies and applications



Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018

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3
E-book
2016

3D stacked chips : from emerging processes to heterogeneous systems



Switzerland : Springer, 2016

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4
E-book
2015

Advances in 3D integrated circuits and systems


Yu, Hao (Electrical engineer), author
New Jersey : World Scientific, 2015

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5
E-book
2014

Design and modeling for 3D ICs and interposers


Swaminathan, Madhavan, author
Hackensack, NJ : World Scientific, 2014

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6
8
E-book
2020

MEMS resonator filters



London, United Kingdom : The Institution of Engineering and Technology, 2020

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9
E-book
2018

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement


Ma, Yue (Electronics engineer), author
Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc, 2018

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10
E-book
2017

Through silicon vias : materials, models, design, and performance


Kaushik, Brajesh Kumar, author.
Boca Raton, FL : CRC Press, Taylor & Francis Group, [2017]

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