2016

3D IC devices, technologies, and manufacturing

Xiao, Hong, 1961- author
Bellingham, Washington, USA SPIE Press, [2016]

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2018

3D integration in VLSI circuits : implementation technologies and applications

Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018

 

2016

3D stacked chips : from emerging processes to heterogeneous systems

Switzerland : Springer, 2016

 

2015

Advances in 3D integrated circuits and systems

Yu, Hao (Electrical engineer), author
New Jersey : World Scientific, 2015

 

2014

Design and modeling for 3D ICs and interposers

Swaminathan, Madhavan, author
Hackensack, NJ : World Scientific, 2014

 

2015

Design of 3D integrated circuits and systems

©2015

 

 

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Li, Er-Ping.
[United States] : IEEE Press ; Hoboken : Wiley

 

2020

MEMS resonator filters

London, United Kingdom : The Institution of Engineering and Technology, 2020

 

2018

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement

Ma, Yue (Electronics engineer), author
Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc, 2018

 

2017

Through silicon vias : materials, models, design, and performance

Kaushik, Brajesh Kumar, author.
Boca Raton, FL : CRC Press, Taylor & Francis Group, [2017]

 

2019

VLSI and Post-CMOS Electronics. Volume 2 : Devices, circuits and interconnects

Stevenage : IET, 2019