| Description |
1 online resource (xxii, 458 pages) : illustrations |
| Contents |
3D IC Integration with TSV/RDL Interposer -- TSV/RDL Interposer with Double-Sided Chip Attachments -- TSV Interposer with Chips on Both Sides -- Low-Cost TSH Interposer for 3D IC Integration -- References -- 9. Thermal Management of 2.5D/3D IC Integration -- Introduction -- Design Philosophy -- The New Design -- Equivalent Model for Thermal Analysis -- Interposer with Chip/Heat Spreader on Its Top Side and Chip on Its Bottom Side -- Interposer with Chip/Heat Spreader on Its Top Side and Chip/Heat Slug on Its Bottom Side -- Interposer with Four Chips on Its Top Side with Heat Spreader -- Thermal Performance between 2.5D and 3D IC Integrations -- Thermal Management System with TSV Interposers with Embedded Microchannels -- References -- 10. Embedded 3D Hybrid Integration -- Introduction -- Trends of Optoelectronic Products -- The Old Design -- High-Frequency Data Link on PCB Using Optical Waveguides -- The Old Design -- Embedded Board-Level Optical Interconnects -- The New Designs -- An Embedded 3D Hybrid Integration Design Example -- Semi-Embedded TSV Interposer with Stress Relief Gap -- References -- 11. 3D LED and IC Integration -- Introduction -- Status and Outlook of Haitz's Law -- LED Has Come a Long Way! -- Four Key Segments of LED Products -- 3D LED and IC Integration -- 2.5D IC and LED Integration -- Thermal Management of 3D LED and IC Integration -- References -- 12. 3D MEMS and IC Integration -- Introduction -- MEMS Packaging -- Design of 3D MEMS and IC Integration -- Assembly Process of 3D MEMS and IC Integration -- Low-Temperature Bonding of 3D MEMS Packaging with Solders -- Recent Developments in Advanced MEMS Packaging -- References -- 13. 3D CMOS Image Sensor and IC Integration -- Introduction -- FI-CIS and BI-CIS -- 3D CIS and IC Stacking -- 3D CIS and IC Integration -- Summary and Recommendations -- References -- 14. 3D IC Packaging -- Introduction -- Chip Stacking by Wirebonding -- Package-on-Package (PoP) -- Wafer-Level Packaging -- Fan-Out eWLP -- Embedded Panel-Level Packaging -- Summary and Recommendations -- References |
| Summary |
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Three-dimensional integrated circuits.
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Microelectronic packaging.
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Microelectronic packaging
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Three-dimensional integrated circuits
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| Form |
Electronic book
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