| Description |
1 online resource |
| Series |
SpringerBriefs in electrical and computer engineering, 2191-8112 |
|
SpringerBriefs in electrical and computer engineering.
|
| Contents |
Introduction -- Background -- Analysis and mitigation of TSV-Induced substrate noise -- TSVs for power delivery -- Early estimation of TSV area for power delivery in 3-D ICs -- Carbon nanotubes for advancing TSV technology -- Conclusions and future directions |
| Summary |
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The a |
| Analysis |
Engineering |
|
Electronics |
|
Systems engineering |
|
Computer science |
|
Circuits and Systems |
|
Processor Architectures |
|
Electronics and Microelectronics, Instrumentation |
| Bibliography |
Includes bibliographical references |
| Subject |
Three-dimensional integrated circuits -- Design.
|
| Form |
Electronic book
|
| Author |
Hassoun, Soha.
|
| LC no. |
2012946733 |
| ISBN |
1283640368 (MyiLibrary) |
|
1461455073 (print) |
|
1461455081 (electronic bk.) |
|
9781283640367 (MyiLibrary) |
|
9781461455073 (print) |
|
9781461455080 (electronic bk.) |
|
