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Book Cover
Author Khan, Nauman

Title Designing TSVs for 3D integrated circuits / Nauman Khan, Soha Hassoun
Published New York, NY : Springer, [2013]
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Description 1 online resource
Series SpringerBriefs in electrical and computer engineering, 2191-8112
SpringerBriefs in electrical and computer engineering.
Contents Introduction -- Background -- Analysis and mitigation of TSV-Induced substrate noise -- TSVs for power delivery -- Early estimation of TSV area for power delivery in 3-D ICs -- Carbon nanotubes for advancing TSV technology -- Conclusions and future directions
Summary This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The a
Analysis Engineering
Systems engineering
Computer science
Circuits and Systems
Processor Architectures
Electronics and Microelectronics, Instrumentation
Bibliography Includes bibliographical references
Subject Three-dimensional integrated circuits -- Design.
Form Electronic book
Author Hassoun, Soha.
LC no. 2012946733
ISBN 1283640368 (MyiLibrary)
1461455073 (print)
1461455081 (electronic bk.)
9781283640367 (MyiLibrary)
9781461455073 (print)
9781461455080 (electronic bk.)