| Description |
1 online resource (1 volume (various pagings)) : illustrations |
| Series |
McGraw-Hill handbooks |
|
McGraw-Hill handbooks.
|
| Contents |
Introduction to Environmentally Benign Electronics Manufacturing -- Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps -- WLCSP with Lead-Free Solder Bumps on PCB/Substrate -- Chip (Wafer)-Level Interconnects with Solderless Bumps -- WLCSP with Solderless Bumps on PCB/Substrate -- Environmentally Benign Molding Compounds for IC Packages -- Environmentally Benign Die Attach Films for IC Packaging -- Environmental Issues for Conventional PCBs -- Halogenated and Halogen-Free Materials for Flame Retardation -- Fabrication of Environmentally Friendly PCB -- Global Status of Lead-Free Soldering -- Development of Lead-Free Solder Alloys -- Prevailing Lead-Free Alloys -- Lead-Free Surface Finishes -- Implementation of Lead-Free Soldering -- Challenges for Lead-Free Soldering -- Introduction to Conductive Adhesives -- Conductivity Establishment of Conductive Adhesives -- Mechanisms Underlying the Unstable Contact Resistance of ECAs -- Stabilization of Contact Resistance of Conductive Adhesives -- Index -- About the Author |
| Summary |
"This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: chip (wafer) level interconnects with lead-free solder bumps; lead-free solder wafer bumping with micro-ball mounting and paste printing methods; lead-free solder joint reliability of WLCSPs on organic and ceramic substrates; chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs; design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate; halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages; environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging; environmental issues for conventional PCBs and substrates; some environmentally conscious flame-retardants for PCBs and organic substrates; emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety. It also includes the topics: lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives; criteria, development approaches, and varieties of alloys and properties of lead-free solders; physical, mechanical, chemical, electrical, and soldering properties of lead-free solders; manufacturing process and performance of lead-free surface finishes for both PCB and component applications; implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process; fundamental understanding of electrically conductive adhesive (ECA) technology; effects of lubricant removal and cure shrinkage on ECAs; mechanisms underlying the contact resistance shifts of ECAs; effects of electrolytes and moisture absorption on contact resistance shifts of ECAs; and stabilization of contact resistance of ECAs using various additives." |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL |
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digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL |
| Subject |
Electronic apparatus and appliances -- Design and construction.
|
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Green electronics.
|
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Environmental protection.
|
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environmental protection.
|
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
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Electronic apparatus and appliances -- Design and construction
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Environmental protection
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Green electronics
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Elektronisches Bauelement
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Umweltverträgliches Produkt
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| Genre/Form |
Internet resources
|
| Form |
Electronic book
|
| Author |
Lau, John H.
|
| ISBN |
0071500871 |
|
9780071500876 |
|
007145005X |
|
9780071450058 |
|
