Book Cover
E-book
Author Ho, P. S., author.

Title Electromigration in metals : fundamentals to nano-interconnects / Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev
Published Cambridge, United Kingdom ; New York, NY : Cambridge University Press, 2022
©2022

Copies

Description 1 online resource (xiii, 417 pages) : illustrations
Contents Introduction to electromigration -- Fundamentals of electromigration -- Thermal stress characteristics and stress induced void formation in aluminium and copper interconnects -- Stress evolution and damage formation in confined metal lines under electric stressing -- Electromigration in Cu interconnect structures -- Scaling effects on microstructure and resistivity of Cu and Co nanointerconnects analysis of electromigration induced stress evolution and voiding in Cu damascene lines with microstructure -- Massive scale statistical studies for electromigration -- Assessment of electromigration damage in large on-chip power grids
Summary "Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers"-- Provided by publisher
Bibliography Includes bibliographical references and index
Notes Description based on online resource; title from digital title page (viewed on May 15, 2022)
Subject Interconnects (Integrated circuit technology) -- Materials
Metals -- Electric properties.
Electrodiffusion.
Electrodiffusion
Metals -- Electric properties
Form Electronic book
Author Hu, Chao-Kun, 1946- author.
Gall, Martin, author.
Sukharev, Valeriy, 1952- author.
LC no. 2021050168
ISBN 9781139505819
1139505815