Description |
1 online resource : illustrations (some color) |
Series |
SpringerBriefs in electrical and computer engineering, 2191-8112 |
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SpringerBriefs in electrical and computer engineering.
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Contents |
Introduction -- Background -- Analysis and mitigation of TSV-Induced substrate noise -- TSVs for power delivery -- Early estimation of TSV area for power delivery in 3-D ICs -- Carbon nanotubes for advancing TSV technology -- Conclusions and future directions |
Summary |
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs |
Analysis |
Engineering |
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Computer science |
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Electronics |
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Systems engineering |
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Circuits and Systems |
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Processor Architectures |
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Electronics and Microelectronics, Instrumentation |
Bibliography |
Includes bibliographical references |
Notes |
Description based on online resource; title from digital title page (viewed on February 16, 2022) |
Subject |
Three-dimensional integrated circuits -- Design
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COMPUTERS -- Logic Design.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI.
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Ingénierie.
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Electronic circuits
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Electronics
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Engineering
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Microelectronics
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Microprocessors
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Form |
Electronic book
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Author |
Hassoun, Soha, author
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ISBN |
9781461455080 |
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1461455081 |
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1461455073 |
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9781461455073 |
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9781283640367 |
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1283640368 |
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