Title ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International

Published Materials Park, Ohio : ASM International, 2008

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Description 1 online resource (xx, 528 pages) : illustrations Contents Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index Notes Some online versions lack accompanying media packaged with the printed version Bibliography Includes bibliographical references and index Notes Print version record Subject Electronics -- Materials -- Testing -- Congresses Electronic apparatus and appliances -- Testing -- Congresses TECHNOLOGY & ENGINEERING -- Electronics -- Digital. TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics. Electronic apparatus and appliances -- Testing Electronics -- Materials -- Testing Genre/Form Conference papers and proceedings Form Electronic book Author ASM International. Electronic Device Failure Analysis Society. ISBN 9781615030910 1615030913

Other Titles International Symposium for Testing and Failure Analysis 2008 Proceedings of the 34th International Symposium for Testing and Failure Analysis 34th International Symposium for Testing and Failure Analysis Thirty-fourth International Symposium for Testing and Failure Analysis

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