The science and technology of adhesive bonding : proceedings of the 35th Sagamore Army Materials Research Conference / edited by Louis H. Sharpe & Stanley E. Wentworth
viii, 3 unnumbered pages of plates : illustrations (some color) ; 25 cm
Summary
Contributors emphasize, in the short term, root cause analysis of bond failures and the development of remedies for bond failure in equipment, in production and in the field. In the long term, the emphasis is on insuring that adequate technology is available for the adhesive bonding of emerging materials
Analysis
Adhesive bonding
Notes
"Originally appeared in Vol. 29 and Vol. 30 of The Journal of adhesion"--T.p. verso