Introduction -- Copper-tin reactions in bulk samples -- Copper-tin reactions in thin-film samples -- Copper-tin reactions in flip chip solder joints -- Kinetic analysis of flux-driven ripening of copper-tin scallops -- Spontaneous tin whisker growth : mechanism and prevention -- Solder reactions on nickel, palladium, and gold -- Fundamentals of electromigration -- Electromigration in in flip chip solder joints -- Polarity effect of electromigration on solder reactions -- ductile-to-brittle transition of solder joints affected by copper-tin reaction and electromigration -- Thermomigration
Summary
"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for improving solder performance without the use of lead."--Jacket
