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Most relevant titles entries 1-1596 |
2024
New York, NY : Humana Press, [2024]
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2024
Rameshwar, Pranela.
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2024
Thomas, Jince
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2024
Third edition. / edited by Tasuku Honjo, Michael Reth, Andreas Radbruch, Frederick Alt, Alberto Martin
Amsterdam : Academic Press, 2024
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2024
London, United Kingdom ; San Diego, CA, United States : Academic Press, an imprint of Elsevier, [2024]
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2024
London : Academic Press, 2024
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2024
Zhang, Leisheng
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2023
Han, Hongwei
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2023
Springer Nature Singapore 2023
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2023
Alonso-Vante, Nicolas
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2023
Springer International Publishing 2023
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2023
New York, NY : Humana Press, [2023]
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2023
New York : Humana Press, [2023]
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2023
Third edition
New York : Humana Press, 2023
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2023
New York, NY : Humana Press, [2023]
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2023
New York, NY : Humana Press, 2023
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2023
New York, NY : Humana Press, [2023]
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2023
Hahn, Yoon-Bong.
Singapore : Jenny Stanford Publishing, 2023
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2023
New York, NY : Humana Press, [2023]
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2023
New York, NY : Humana Press, 2023
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2023
New York, NY : Humana Press, 2023
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2023
New York, NY : Humana Press, 2023
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2023
Singapore : Springer, 2023
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2023
Singapore : Springer, [2023]
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2023
Singapore : Springer, [2023]
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2023
Saucedo, Leslie, author
Cham : Springer, [2023]
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2023
Chatterjee, Sankar, author.
Cham, Switzerland : Springer, [2023]
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2023
Singapore : Springer, 2023
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2023
Singapore : Springer, 2023
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2023
Arya, Sandeep
Singapore : Springer Singapore Pte. Limited, 2023
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2023
Cham : Springer, [2023]
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2023
Dai, Changsheng, author.
Cham : Springer, 2023
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2023
Amsterdam, Netherlands ; Oxford, United Kingdom ; Cambridge MA : Elsevier, [2023]
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2023
Cambridge, MA : Woodhead Publishing, [2023]
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2023
Second edition
Amsterdam : Academic Press, 2023
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2023
Innovations in Regenerative Medicine and Cancer Research Conference (5th)
Cham : Springer, [2023]
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2023
Second edition
Cham, Switzerland : Springer, [2023]
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2023
Cham, Switzerland : Springer, [2023]
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2023
Singapore : Springer, [2023]
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2023
Zhang, Leisheng, author
London ; San Diego, CA : Academic Press, an imprint of Elsevier, [2023]
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2022
Bansal, Shyam S
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2022
McCrea, Gavin
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2022
Weinheim, Germany : Wiley-VCH, [2022]
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2022
World Intellectual Property Organization.
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