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Keywords (1-8 of 8)
Most relevant titles
entries 1-3
1
2014
Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers
Franke, Jörg (Prof. Dr.-Ing.), author.
Munich ; Cincinnati, OH : Hanser, [2014]
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Electronic Resources
2
2014
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September
International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg, Germany, and Fuerth, Germany)
Pfaffikon, Switzerland : TTP, 2014
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Electronic Resources
3
International Congress Molded Interconnect Devices (MID) scientific proceedings
International Congress Molded Interconnect Devices
Piscataway, NJ : IEEE
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entries 4-7
4
2015
Plasma etching processes for interconnect realization in VLSI
London : ISTE Press ; Oxford : Elsevier Ltd, 2015
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Electronic Resources
5
2013
Robotics in smart manufacturing : International Workshop, WRSM 2013, Co-located with FAIM 2013, Porto, Portugal, June 26-28, 2013. Proceedings
Workshop on Robotics in Smart Manufacturing (2013 : Porto, Portugal)
Heidelberg : Springer, [2013]
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Electronic Resources
6
2012
Manufacturing engineering and technology for manufacturing growth : selected, peer reviewed papers from the 2012 International Conference on Manufacturing Engineering and Technology for Manufacturing
Switzerland : Trans Tech Publications Ltd, [2012]
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Electronic Resources
7
2007
Digital enterprise technology : perspectives and future challenges
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Electronic Resources
Other relevant titles
entries 8-8
8
2002
Proceedings of the International Conference on Scientific & Engineering Computation (IC-SEC) 2002 : recent advances in computational science & engineering : 3-5 December 2002, Raffles City Convention
International Conference on Scientific & Engineering Computation (2002 : Singapore)
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