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Authors (Last name first) (1-4 of 4)
American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
1
E-book
2013

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : July 16-18, 2013, Burlingame, California, USA


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, California, USA)

New York, N.Y. : American Society of Mechanical Engineers, 2013

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2
E-book
2020

Proceedings of the ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems -2020 - : presented at ASME 2020 International Technical Conference on P


ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online)

New York, N.Y. : The American Society of Mechanical Engineers, [2020]

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3
E-book
2010

Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA


ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)



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4
E-book
2012

Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 : presented at ASME 2011 Pacific Rim Techn


ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2011 : Portland, Or.)

New York : American Society of Mechanical Engineers, [2012]

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