| Description |
1 online resource (xiv, 452 pages) : illustrations |
| Contents |
Cover -- Contents -- Preface -- Contributors -- Introduction -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R & D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance -- 4.1. Introduction to Component "Lead-Free" Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures -- 4.7. Frequency Control Products -- 4.8. "Lead-Free" Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability-General -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determ |
| Summary |
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the s |
| Bibliography |
Includes bibliographical references and index |
| Subject |
Lead-free electronics manufacturing processes.
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Solder and soldering.
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solder.
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TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
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Lead-free electronics manufacturing processes
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Solder and soldering
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| Form |
Electronic book
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| Author |
Bradley, Edwin.
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| ISBN |
9780470171479 |
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0470171472 |
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9780470171462 |
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0470171464 |
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1281032484 |
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9781281032485 |
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