Title Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA / sponsored by the Electronic Materials and Processing Division of ASM International

Published Materials Park, OH : ASM International, [1992] ©1992

Copies

Location	Call no.	Vol.	Availability
W'PONDS	621.381046 Ele/Epm 1992		AVAILABLE

Description viii, 260 pages : illustrations ; 29 cm Bibliography Includes bibliographical refrences Subject Electronic packaging -- Congresses. Electronic packaging -- Materials -- Congresses. Microelectronic packaging -- Materials -- Congresses. Genre/Form Conference papers and proceedings. Author ASM International. Electronic Materials and Processing Division. LC no. 92075118 ISBN 0871704498

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