Title Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan / edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir

Published Zurich : Trans Tech Publications Ltd, [2018] ©2018

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Description 1 online resource Series Solid state phenomena ; volume 273 Diffusion and defect data. Pt. B, Solid state phenomena ; volume 273. Notes Online resource; title from PDF title page (EBSCO, viewed June 29, 2018) Subject Electronic packaging -- Congresses Electronic packaging -- Materials -- Congresses TECHNOLOGY & ENGINEERING -- Mechanical. Electronic packaging Electronic packaging -- Materials Genre/Form Conference papers and proceedings Form Electronic book Author Nogita, Kazuhiro, editor Salleh, Mohd Arif Anuar Mohd, editor Abdullah, Mohd Mustafa Al Bakri, editor Jamaludin, Liyana, editor Mohd Tahir, Muhammad Faheem, editor ISBN 9783035733242 3035733244

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