| Description |
1 online resource (273 p.) |
| Contents |
Cover -- Title Page -- Copyright -- Contents -- Preface -- Author Biographies -- List of Acronyms and Abbreviations -- Chapter 1 Introduction -- 1.1 Different Interfaces in OFETs -- 1.2 Brief Historic Overview of Interface Engineering in OFETs -- 1.3 Scope of the Book -- Chapter 2 Interfacial Modification Methods -- 2.1 Noncovalent Modification Methods -- 2.1.1 Charge Insertion Layer at the Electrode Surface -- 2.1.2 Dielectric Surface Passivation Methods -- 2.2 Covalent Modification Methods -- 2.2.1 SAM Modification of Electrodes -- 2.2.2 SAM Modification of Dielectrics |
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2.2.2.1 SAM/SiO2 Dielectrics -- 2.2.2.2 SAM/High-k Dielectrics -- 2.2.2.3 Self-Assembled Monolayer Field-Effect Transistors (SAMFETs) -- 2.3 Efforts in Developing New Methods -- Chapter 3 Semiconductor/Semiconductor Interface -- 3.1 Influence of Additives on a Material's Nucleation and Morphology -- 3.1.1 Solvent Additives -- 3.1.2 Nucleating Agents -- 3.1.3 Template-Mediated Crystallization -- 3.1.4 Blending with Insulating Polymers -- 3.1.5 Blending with Polymer Elastomer: Nanoconfinement Effect -- 3.2 Enhancing the Performance Through Semiconductor Heterojunctions |
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3.2.1 Planar Bilayer Heterostructures -- 3.2.2 Molecular-Level Heterojunction -- 3.2.3 Supramolecular Arrangement of the Heterojunctions -- 3.3 Integrating Molecular Functionalities into Electrical Circuits -- 3.3.1 Charge-Trapping-Induced Memory Effect -- 3.3.2 Photochromism-Induced Switching Effect -- Chapter 4 Semiconductor/Electrode Interface -- 4.1 Work Function Tuning for Better Contact -- 4.1.1 SAM Modification -- 4.1.2 Charge Insertion Layer Modification -- 4.1.3 Polymer-Based Electrodes -- 4.1.4 Carbon Nanomaterial-Based Electrodes -- 4.1.5 Covalent Bond Formation at the Molecular Level |
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4.2 Installing Switching Effects at Semiconductor/Electrode Interface -- Chapter 5 Semiconductor/Dielectric Interface -- 5.1 Dielectric Modification to Tune Semiconductor Morphology -- 5.1.1 Dielectric Surface Energy Control -- 5.1.1.1 Modify with SAM -- 5.1.1.2 Surface Modification with Polymers -- 5.1.2 Dielectric Microstructure Design -- 5.1.2.1 Roughness Effect -- 5.1.2.2 Nano-fabrication Created Microstructure -- 5.1.2.3 Self-assembled Morphology of Dielectric -- 5.2 Eliminating Interfacial Traps -- 5.2.1 Dielectric Surface Passivation (Treatment) Methods |
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5.2.1.1 Polymer Encapsulation of Dielectrics -- 5.2.1.2 Gap Dielectrics -- 5.2.2 SAM/SiO2 Dielectrics -- 5.2.2.1 Provide Efficient Insulating Barrier Height -- 5.2.2.2 Control Surface Polarity and Carrier Density -- 5.2.3 SAM/High-k Dielectrics -- 5.2.3.1 Fundamentals of SAM-Modified High-k Dielectrics -- 5.2.3.2 SAM/High-k Hybrid Dielectrics for Flexible Substrate -- 5.2.4 Self-assembled Monolayer Field-Effect Transistors (SAMFETs) -- 5.2.4.1 Molecule Design for SAMFETs -- 5.2.4.2 Morphology Control of SAMFET -- 5.3 Integrating New Functionalities -- 5.3.1 Photoresponsive Dielectrics |
| Notes |
Description based upon print version of record |
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5.3.2 Other External Stimuli-Responsive Dielectrics |
| Form |
Electronic book
|
| Author |
Chen, Hongliang
|
| ISBN |
9783527840472 |
|
3527840478 |
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3527840486 |
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9783527840489 |
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