| Description |
1 online resource (260 p.) |
| Contents |
Cover -- Half Title -- Title Page -- Copyright Page -- Foreword -- Preface -- Table of Contents -- Chapter 1: Geometric Optimization of Cooling Techniques -- Chapter 2: Entrance Design Correlations for Circuit Boards in Forced-Air Cooling -- Chapter 3: Forced Air Cooling of Low-Profile Package Arrays -- Chapter 4: Conjugate Heat Transfer in Forced Air Cooling of Electronic Components -- Chapter 5: Enhanced Air Cooling of Electronic Equipment -- Chapter 6: Limits of Air Cooling-A Methodical Approach -- Index |
| Notes |
Description based upon print version of record |
| Form |
Electronic book
|
| Author |
Lee, Sang Woo
|
| ISBN |
9781000108590 |
|
1000108597 |
|
