| Description |
1 online resource (x, 108 pages) : illustrations (some color) |
| Series |
Synthesis lectures on computational electromagnetics, 1932-1716 ; #17 |
|
Synthesis lectures on computational electromagnetics (Online) ; #17.
|
| Contents |
1. Introduction -- 2. Background on technologies for millimeter-wave passive front-ends -- 2.1. 3D Integrated SOP concept -- 2.2. LTCC multilayer technology -- 2.3. 60 GHz transmitter/receiver modules -- 3. Three-dimensional packaging in multilayer organic substrates -- 3.1. Multilayer LCP substrates -- 3.2. RF MEMS packaging using multilayer LCP substrates -- 3.3. Active device packaging using multilayer LCP substrates -- 3.4. Three-dimensional paper-based modules for RFID/sensing applications -- 4. Microstrip-type integrated passives -- 4.1. Patch resonator filters and duplexers -- 4.2. Quasielliptic filter -- 5. Cavity-type integrated passives -- 5.1. Rectangular cavity resonator -- 5.2. Three-pole cavity filters -- 5.3. Vertically stacked cavity filters and duplexers -- 5.4. Cavity-based dual-mode filters -- 6. Three-dimensional antenna architectures -- 6.1. Patch antenna using a soft-surface structure -- 6.2. High-gain patch antenna using soft-surface structure and stacked cavity -- 6.3. Dual-polarized cross-shaped microstrip antenna -- 6.4. Series-fed antenna array -- 7. Fully integrated three-dimensional passive front-ends -- 7.1. Passive front-ends for 60 GHz time-division duplexing (TDD) applications -- 7.2. Passive front-ends for 60 GHz frequency-division duplexing applications -- References |
| Summary |
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules |
| Notes |
Title from PDF title page (viewed January 23, 2008) |
|
Introduction (p. vii-x) erroneously included from the publication: Estimation of cortical connectivity in humans : advanced signal processing techniques / Laura Astolfi and Fabio Babiloni. ©2008 |
| Bibliography |
Includes bibliographical references (pages 99-106) |
| Subject |
Microelectronic packaging.
|
|
Millimeter wave communication systems.
|
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Wireless communication systems.
|
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
|
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
|
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Microelectronic packaging
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Millimeter wave communication systems
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Wireless communication systems
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| Form |
Electronic book
|
| Author |
Tentzeris, Manos M.
|
| ISBN |
1598292455 |
|
9781598292459 |
|
9783031017032 |
|
303101703X |
|
