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Book Cover
E-book
Author Zhang, Hengyun, author

Title Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
Published Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]

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Description 1 online resource
Series Woodhead Publishing series in electronic and optical materials
Series on advanced electronic packaging technology and key materials
Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials
Bibliography Includes bibliographical references and index
Notes Online resource; title from digital title page (viewed on February 4, 2020)
Subject Electronic apparatus and appliances -- Packaging.
Electronic apparatus and appliances -- Packaging
Form Electronic book
Author Che, Faxing, author
Lin, Tingyu, author
Zhao, Wensheng, author
ISBN 9780081025338
0081025335