Power, Junction Temperature, and Reliability -- Burn-in as a Reliability Screening Test -- Thermal and Electrothermal Modeling -- Thermal Runaway and Thermal Management -- Low Temperature CMOS Operation
Summary
"In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in a significant reduction in the device lifetime."--Jacket
