| Description |
1 online resource (407 p.) |
| Contents |
Cover -- Half Title -- Title Page -- Copyright Page -- Dedication -- Contents -- Preface -- Foreword -- Author Biography -- Chapter 1: Analytical Modeling, Its Role and Significance -- References -- Chapter 2: Method of Interfacial Compliance -- 2.1. Introduction -- 2.2. Stresses in the Midportion of a Multimaterial Body Subjected to a Change in Temperature -- 2.3. Bimaterial Assembly: Interfacial Shearing Stresses -- 2.4. Bimaterial Assembly: Interfacial Peeling Stresses -- 2.5. Trimaterial Assembly: Interfacial Shearing Stresses -- 2.6. Trimaterial Assembly: Interfacial Peeling Stresses |
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2.7. Numerical Example -- 2.8. Bimaterial Assembly Subjected to Thermal Stress: Propensity to Delamination Assessed Using the Interfacial Compliance Model -- 2.8.1. Background/Incentive -- 2.8.2. Strain Energy Release Rate (SERR) Computed Using the Interfacial Compliance Approach -- 2.8.3. Adequate SERR Specimen's Length -- 2.8.3.1. Numerical Example #1 -- 2.8.3.2. Numerical Example #2 -- 2.8.4. Probabilistic Approach: Application of the Extreme Value Distribution -- 2.8.5. Probabilistic Approach: Numerical Example |
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Appendix A: Convolution of Extreme Value Distribution with a Normally Distributed Variable -- Appendix B: A Numerical Integration Example -- References -- Chapter 3: Thermal Stress in Assemblies with Identical Adherends -- 3.1. Introduction -- 3.2. Bell Labs Si-on-Si multi-chip flip-chip Packaging Technology -- 3.3. Simplest Elongated Assembly with Identical Adherends -- 3.4. Assembly with Identical Adherends Subjected to Different Temperatures: Thermal Stresses in a Multileg Thermoelectric Module Design -- 3.4.1. Motivation -- 3.4.2. Background -- 3.4.3. Basic Equation |
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3.4.4. Theorem of Three Axial Forces -- 3.4.5. Special Cases -- 3.4.5.1. Homogeneously Bonded Assembly -- 3.4.5.2. Assembly Bonded at the Ends (Two-Legged TEM) -- 3.4.5.3. Midportion of a Long Multilegged Assembly -- 3.4.6. TEM Designs in Figures 3.11 and 3.12 -- 3.4.7. TEM Designs in Figures 3.11 and 3.12 -- 3.4.8. Design in Figure 3.12 for a High-Temperature Power Generation TEM -- 3.4.9. Ultrathin and Long (Beam-Like) Legs -- 3.5. Predicted thermal stress in a circular bonded assembly with identical adherends -- 3.5.1. Motivation -- 3.5.2. Assumptions -- 3.5.3. Basic Equation |
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3.5.4. Solution to the Basic Equation -- 3.5.5. Large and/or Stiff Assemblies -- 3.5.6. Normal Stresses in the Bonding Layer -- 3.5.7. Bow -- 3.5.8. Bending Stresses in the Adherends -- 3.5.9. Peeling Stress -- 3.5.10. Numerical Example -- References -- Chapter 4: Inelastic Strains in Solder Joint Interconnections -- 4.1. Background/Motivation -- 4.2. Assumptions -- 4.3. Shearing Stress -- 4.3.1. Basic Equation -- 4.3.2. Boundary Conditions -- 4.3.4. Elasto-Plastic Solution -- 4.3.5. Possible Numerical Procedure for Solving the Elasto-Plastic Equations |
| Notes |
Description based upon print version of record |
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4.3.6. Predicted Lengths of the Plastic Zones Based on an Elastic Solution |
| Form |
Electronic book
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| ISBN |
9780429863820 |
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0429863829 |
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