Title Physical design for 3D integrated circuits / edited by Aida Todri-Sanial, CNRS-LIRMM, France, Chuan Seng Tan, Nanyang Technological University, Singapore, Krzysztof Iniewski, managing editor, Emerging Technologies CMOS Inc., Vancouver, British Columbia, Canada

Published Boca Raton : CRC Press, Taylor & Francis Group, [2016] ©2016

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Description 1 online resource (328 pages) : illustrations Series Devices, circuits, and systems Devices, circuits, and systems. Contents Front Cover; Contents; Preface; Acknowledgments; Editors; Contributors; Section I -- 3D Integration Overview; Chapter 1 -- 2.5D/3D ICs: Drivers, Technology, Applications, and Outlook; Chapter 2 -- Overview of Physical Design Issues for 3D-Integrated Circuits; Chapter 3 -- Detailed Electrical and Reliability Study of Tapered TSVs; Chapter 4 -- 3D Interconnect Extraction; Chapter 5 -- 3D Placement and Routing; Chapter 6 -- Power and Signal Integrity Challenges in 3D Systems-on-Chip; Chapter 7 -- Design Methodology for TSV-Based 3D Clock Networks Chapter 8 -- Design Methodology for 3D Power Delivery NetworksChapter 9 -- Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits; Chapter 10 -- Thermal Modeling and Management for 3D Stacked Systems; Chapter 11 -- Exploration of the Thermal Design Space in 3D Integrated Circuits; Chapter 12 -- Dynamic Thermal Optimization for 3D Many-Core Systems; Chapter 13 -- TSV-to-Device Noise Analysis and Mitigation Techniques; Chapter 14 -- Overview of 3D CAD Design Tools; Chapter 15 -- Design Challenges and Solutions for Monolithic 3D ICs Chapter 16 -- Design of High-Speed Interconnects for 3D/2.5D ICs without TSVsChapter 17 -- Challenges and Future Directions of 3D Physical Design; Back Cover Bibliography Includes bibliographical references Notes English Print version record Subject Three-dimensional integrated circuits -- Design and construction TECHNOLOGY & ENGINEERING -- Mechanical. Form Electronic book Author Todri-Sanial, Aida, editor. Tan, Chuan Seng, editor. Iniewski, Krzysztof, 1960- editor. ISBN 1498710379 9781498710374 9781498710367 1498710360

Other Titles Physical design for three-D integrated circuits

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