| Description |
1 online resource (xxix, 606 pages) : illustrations (some color) |
| Series |
Electronic engineering |
|
McGraw-Hill electronic engineering series.
|
| Contents |
Introduction to RoHS-compliant semiconductor and packaging technologies. ; Reliability engineering of lead-free interconnects. ; Notes on failure criteria. ; Reliability of 1657-Pin CCGA lead-free solder joints. ; Reliability of PBGA lead-free solder joints (with and without Underfills). ; Reliability of LED lead-free interconnects. ; Reliability of VCSEL lead-free interconnects. ; Reliability of low-temperature lead-free (SnBiAg) solder joints. ; Reliability of lead-free (SACX) solder joints. ; Chip-to-wafer (C2W) bonding and lead-free interconnect reliability. ; Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability. ; Through-silicon-via (TSV) interposer reliability. ; Electromigration of lead-free microbumps for 3-D IC integration. ; Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results. ; Effects of high strain rate (impact) on SAC solder balls/bumps. ; Effects of voids on solder joint[s] reliability |
| Summary |
"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"-- Provided by publisher |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Interconnects (Integrated circuit technology) -- Reliability
|
|
Green technology -- Reliability
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- Optoelectronics.
|
|
TECHNOLOGY & ENGINEERING -- Electronics -- General.
|
| Genre/Form |
Internet resources
|
| Form |
Electronic book
|
| ISBN |
9780071753807 |
|
007175380X |
|
0071773339 |
|
9780071773331 |
|
