Title Copper interconnect technology / Christoph Steinbruche, Barry Chin

Published Bellingham, Washington : SPIE Optical Engineering Press, 2001

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Description 1 online resource (viii, 122 pages) : illustrations Series Tutorial texts in optical engineering ; v. TT46 Tutorial texts in optical engineering ; TT46 Contents 1. Introduction: Acknowledgments -- 2. Interconnect issues: 2.1. Overview; 2.2. Materials requirements; 2.3. Materials options; 2.4. Multilevel interconnect fabrication -- 3. Copper deposition: 3.1. Overview; 3.2. Chemical deposition methods for copper; 3.3. Physical deposition methods for copper -- 4. Copper patterning: 4.1. Overview; 4.2. Subtractive copper patterning; 4.3. Additive copper patterning by chemical-mechanical polishing (CMP) -- 5. Interlayer dielectrics: 5.1. Silicate-based ILDs; 5.2. Organic polymer-based ILDs; 5.3. Patterning of ILDs -- 6. Cu/ILD barriers: 6.1. Cu/undoped-SiO2 barriers; 6.2. Cu/doped-SiO2 barriers; 6.3. Cu/polymerbarriers -- 7. Current practice: 7.1. Overview; 7.2. Preclean; 7.3. Barrier layers; 7.4. Copper fill methods; 7.5. Future directions -- References -- Index Summary Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found Notes "SPIE Digital Library."--Website Bibliography Includes bibliographical references (pages 103-117) and index Subject Electronic packaging. Semiconductors -- Junctions. Microelectronic packaging. Copper. coppers (regalia) TECHNOLOGY & ENGINEERING -- Mechanical. Copper Electronic packaging Microelectronic packaging Semiconductors -- Junctions Verbindungstechnik CVD-Verfahren Drahtbonden Halbleitergehäuse Kupfer Mikroelektronik Semiconducteurs -- Junctions. Cuivre. Form Electronic book Author Chin, Barry Lee, author Society of Photo-optical Instrumentation Engineers, publisher LC no. 00045049 ISBN 9781510608030 1510608036

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