Title International Congress Molded Interconnect Devices (MID) scientific proceedings

Published Piscataway, NJ : IEEE

Online access available from: IEEE Xplore    01 Jan. 2016- View Resource Record

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Description Online resource Notes Description based on: 12th (2016); title from title page Latest issue consulted: 12th (2016) Subject Molded interconnect devices -- Congresses Molded interconnect devices -- Design and construction -- Congresses Mechatronics -- Materials -- Congresses Three-dimensional display systems -- Congresses Form Electronic journal LC no. 2018207247

Other Titles MID Scientific proceedings

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