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E-book

Title Semiconductor Devices in Harsh Conditions
Published Boca Raton : CRC Press LLC Florence : Taylor & Francis Group [distributor]

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Description 1 online resource
Series Devices, Circuits, and Systems Ser
Devices, Circuits, and Systems Ser
Contents Cover; Half Title; Title Page; Copyright Page; Contents; Foreword; Preface; Editors; Contributors; Section I: Radiation; 1. Commercial Off-the-Shelf Components in Space Applications; 2. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues; 3. Simulation of Single-Event Effects on Fully Depleted Silicon-on-Insulator (FDSOI) CMOS; Section II: Sensors and Operating Conditions; 4. Electronic Sensors for the Detection of Ovarian Cancer; 5. Sensors and Sensor Systems for Harsh Environment Applications
6. III-Nitride Electronic Devices for Harsh EnvironmentsSection III: Packaging and System Design; 7. Packaging for Systems in Harsh Environments; 8. Corrosion Resistance of Lead-Free Solders under Environmental Stress; 9. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement; 10. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via; Index
Summary Semiconductor Devices in Harsh Conditions introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity. This book focuses on radiation, operating conditions, sensor systems, package, and system design. It is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions
Audience College Audience CRC Press LLC
Notes Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force. WlAbNL
Subject Semiconductors -- Reliability
Extreme environments.
Environmental testing.
accelerated weathering.
TECHNOLOGY & ENGINEERING -- Mechanical.
Environmental testing
Extreme environments
Semiconductors -- Reliability
Form Electronic book
Author Weide-Zaage, Kirsten, editor
Chrzanowska-Jeske, Malgorzata, editor
ISBN 149874382X
9781498743822
9781315351940
1315351943