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Book Cover
E-book

Title LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara
Published Cambridge ; New York : Cambridge University Press, 2012

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Description 1 online resource
Series The Cambridge RF and microwave engineering series
Cambridge RF and microwave engineering series.
Contents Cover; LCP for Microwave Packages and Modules; Series; Title; Copyright; Contents; Preface; 1: Introduction to electronic package engineering; 1.1 A brief discussion of standard packages; 1.2.2 Weight requirements; 1.2.3 Package physical requirements; 1.2.4 Package thermal requirements; 1.2.6 Package material requirements; 1.3 Package design process; 1.3.1 Technology selection; 1.3.2 Computer-aided design (CAD); 1.3.3 Test and measurement; 1.4 Concluding remarks; 2: Characteristics of liquid crystal polymer (LCP); 2.1 LCP chemistry; 2.1.1 Liquid crystalline characteristics
Summary A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering
Bibliography Includes bibliographical references and index
Notes Print version record
Subject Microwave devices -- Materials
Microelectronic packaging -- Materials
Liquid crystal devices.
Polymer liquid crystals.
TECHNOLOGY & ENGINEERING -- Microwaves.
Liquid crystal devices.
Microelectronic packaging -- Materials.
Microwave devices -- Materials.
Polymer liquid crystals.
Form Electronic book
Author Pham, Anh-Vu H.
Chen, Morgan J.
Aihara, Kunia.
ISBN 9781139423700
1139423703
9780511777240
0511777248
9781139421669
1139421662
1139419617
9781139419611