Title Ionized physical vapor deposition / edited by Jeffrey A. Hopwood

Published San Diego : Academic Press, ©2000

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Description 1 online resource (xii, 253 pages) : illustrations Series Thin films ; v. 27 Thin films (San Diego, Calif.) ; v. 27. Contents The role of ionized physical vapor deposition in integrated circuit fabrication / Jeffrey A. Hopwood -- High-density plasma sources / Amy E. Wendt -- Ionization by radio freguency inductively coupled plasma / Steve Rossnagel -- Ionization by microwave electron cyclotron resonance plasma / William M. Holber -- Ionized hollow cathode magnetron sputtering / Kwok F. Lai -- Applications and properties of ionized physical vapor deposition films / John Forster -- Plasma physics / Jeffrey A. Hopwood -- Numerical modeling / Ming Li, Michael A. Vyvoda, and David B. Graves Summary This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference. Key Features: The first comprehensive volume on ionized physical vapor deposition Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD Emphasizes practical applications in the area of IC fabrication and interconnect technology Serves as a guide to select the most appropriate technology for any deposition application *This single source saves time and effort by including comprehensive information at one's finger tips *The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD *The numerous practical applications assist the working engineer to select and refine thin film processes Bibliography Includes bibliographical references and indexes Notes English Print version record Subject Thin film devices -- Design and construction Physical vapor deposition. Thin films. TECHNOLOGY & ENGINEERING -- Electronics -- Solid State. TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors. Physical vapor deposition Thin film devices -- Design and construction Thin films Form Electronic book Author Hopwood, Jeffrey A. ISBN 9780125330275 0125330278 9780080542935 008054293X 1281054348 9781281054340 9786611054342 6611054340

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